SYNOPSIS OF SEMINARS

(Detailed outlines and instructor biographies are available on request)

Modern Electronics Packaging- This highly popular seminar presents both the fundamentals and the present state-of-the-art for all of the disciplines which make-up electronics packaging and for all levels of packaging. Electrical, mechanical, thermal, manufacturing and materials disciplines are covered, as are packaging levels for chip packaging to circuit board assemblies to subsystems and systems packaging. A wealth of information, data and guidelines is included.

Ball Grid Array, Chip Scale, Flip Chip and Direct Chip Attachment Technologies- This cutting edge seminar will present the state-of-the-art for all of these packaging technologies which constitute the current revolution in electronic packaging. The nature of each of these technologies and the relation between them will be clearly explained. All technical aspects of these technologies will be covered, including packaging systems, chip interconnection materials and processes, chip protection and mounting, layout systems, electrical characteristics - and importantly, solder joint and interconnect reliability.

Ball Grid Array Technology- This comprehensive and thorough seminar offers a very detailed presentation on all aspects of ball grid array technology. Subjects covered include an excellent introduction to BGA technology, package types including micro BGA packages, substrates, interconnections, encapsulation, design rules, solder balls and solder columns, substrate fabrication processes, assembly materials and processes, critical fabrication issues, in-house vs. contract assembly, failure mechanisms and reliability, thermal management, electrical characteristics, test and burn-in, board level assembly, and much more.

Advanced Hybrid Microcircuit and Multichip Module Packaging Technologies- This thoroughly practical and state-of-the-art seminar provides detailed information and guidelines for all of the critical areas which are important in the strongly emerging technology of multichip modules and advanced hybrid microcircuits. Subjects include substrates for MCM-L, MCM-C and MCM-D technologies, thin film materials and processes, assembly processes, chip interconnection techniques, cleaning and reworking, testing, design guidelines, failure analysis, high density interconnect technologies, coatings and partical immobilization, high performance non-hermetic packaging and the growing role of diamond materials.

Surface Mount Technology- This course is designed to explain SMT design and manufacturing principles in an easy-to-follow format. The step by step instructional approach integrates videotapes that detail all facets of SMT manufacturing from board fabrication through assembly line processes. Samples of various SMT components and state of the art populated PCBs are exhibited to provide a practical insight into the technology. Throughout the workshop, attendees will have opportunities to consider "real world" case studies in SMT implementation drawn from the instructor's experience. There will also be open discussion periods where your specific SMT questions can be addressed.

Surface Mount Testing Technologies- As the trend towards increased PCB complexity continues, there is a growing need to address testing issues at increasingly earlier stages of the design process. With high-density boards comes the challenge of 200hmz device speeds and reduced physical access for testing, fault diagnosis, and repair. Manufacturing high quality, reliable products requires concentrated effort in two closely related areas covered in this course. They are:
    1 . Maintaining tight control of manufacturing processes to achieve high first-time yields.
    2. Developing an overall test strategy that provides both early fault detection and feedback of failure data to identify root causes of manufacturing defects.

Microvias and Other Advanced Printed Wiring Board Technologies- This state-of-the-art course thoroughly covers all of the major advances which have recently been so active in this critical baseline for electronic packaging. This includes the many new laminate materials for high stability and low electrical losses, the dynamic area of microvias and built-up multilayers, fine line technologies, high aspect ratio plating, integrated passive components, new finishes, advanced techniques for electrical test, and the new and environmentally safer processes and their effects on properties and reliability.

Electronics Packaging of High Speed Circuitry- This advanced packaging seminar is a must for the increasing number of engineers required to understand and use high speed circuitry. Subjects presented in depth include the nature of signal propagation, transmission line fundamentals, characteristic impedance, microstrip and stripline, materials for high speed packaging, noise reflections, crosstalk, circuit board assemblies, hybrids and multichip modules, device packages, active digital components, active analog components, passive components, connectors, and packaging guidelines for high speed circuitry.

Electronic Packaging of Microwave Systems- This seminar thoroughly covers all of the important considerations for this rapidly expanding area of electronic packaging. The often difficult fundamentals are clearly explained, practical guidelines and use information are given, and advanced concepts are presented. Subjects covered include an understanding of the microwave band, waves, microwave signals, electrical conductivity and resistance, materials for microwave packaging, distributed and lumped microwave components, microwave devices and integrated assemblies, designing microwave assemblies, electrical factors in microwave packaging, stripline and microstrip, transitions, the development cycle,  critical manufacturing parameters, quality and reliability and more.

High Speed Digital Circuit Design- This popular advanced electrical design seminar thoroughly covers all of the important subjects critical to this design area. Areas presented include digital technology, synchronous and non-synchronous design, transmission line effects, board and motherboard layout, all aspects of circuit design from selection of logic devices to interface protection to design with structured devices to line inspection issues, and finally, design quality techniques and verification.

Mixed Analog / Digital Circuit Design- This also very popular electrical design seminar covers the fundamentals of mixed signal IC design. It covers basic processes and models, design methodologies, signal integrity, A/D and D/A conversion, and text of mixed signal ICs. Topics included are CMOS processes and VLSI fundamentals, design methodology and design styles, mixed signal issues, A/D and D/A fundamentals, A/D converters, D/A converters, mixed signal test and mixed signal vs. separate ASICs.

Integrated Circuits and Electronic Devices for Engineers and Managers- This is a highly informative and practical seminar for non-electrical engineers who want to gain a fundamental understanding of transistors, integrated circuits, and other important electronic devices and for engineering and corporate managers who want to refresh their information in this critical field. The seminar will not only review fundamentals, but will project where the technology is headed over the next few years. Subjects covered will include a fundamental description of solid state physics and how it relates to the performance of today's integrated circuits and electron devices, material properties, structures, and fabrication techniques leading to the development of today's and tomorrow's integrated circuits. Scaling and limitations to the integrated circuit revolution will be described. All areas of advanced electronics will be covered in a clearly understandable presentation.

Modern Electronic Connectors and Technology- This comprehensive and highly practical seminar comprehensively covers the fundamentals of connector technology from materials/design issues to application considerations. The four fundamental elements of a connector: contact interface, contact finish, contact spring and connector housing, and their functions/requirements will be reviewed. Separable and permanent connection technologies will be discussed. Signal and power application guidelines will be offered. The purposes and practices of connector evaluation for performance and reliability will be reviewed.

Materials for Electronic Packaging- This widely received seminar clearly explains the important types of modern electronic packages and the increasing criticality of materials in their success for advanced electronic systems. Types of packages to be discussed will include surface mount, ball grid array, flip chip, chip scale, chip on board, tape automated bonded and others for high performance conventional, high speed and microwave systems. Material categories to be discussed include plastics and polymers, ceramics, composites, metallizations, solders, thick and thin films, and others. Special emphasis will be given to explaining, in easy to understand presentations, the critical electrical and non-electrical properties of materials, and the important forms and compositions of materials, as they affect modern electronic packages and systems.

Advanced Electronic Substrate Materials for RF and Microwave Circuitry- This comprehensive and thoroughly up-to-date seminar fully covers all of the important factors in this most critical area of modern RF and microwave systems. Subjects include the roles of conductors and dielectrics, all of the electrical characteristics of microwave and RF circuits and substrates, transmission line configurations, material processing and performance, evaluation methods for dielectrics, analytical tools such as HFSS and SPICE, intended and unintended coupling, crosstalk and shielding, connectors and cabling, and much more.

Plastics for Electronics- This seminar explains and simplifies the critically important selection of the proper plastic for the large variety of applications in the electronics industry. The myriad of plastics and plastic processes, so very difficult for non-plastic specialists, is fully and clearly explained in this seminar. Subjects include thermoplastic materials and processes, thermoset materials and processes, molding, laminates, adhesives, casting, potting, encapsulation, coatings, elastomers, understanding electrical and physical properties of plastics and much more.

Conformal Coating Technologies- This practical and informative seminar will fully cover the materials, process, problems and tradeoffs required to make the optimum selections for circuit board coating. All accepted conformal coatings and coating processes will be covered, including liquid, solid, vapor deposited, solventless, UV curable, and other coatings. Environmental testing and performance will also be covered, especially electrical degradation in humid environments, and performance acceptability criteria.

Reliability of Plastic Encapsulated Microelectronics- This timely and important seminar, dealing with one of the highest profile subjects related to low cost, high performance electronic packaging, addresses the complete spectrum of problems and solutions in the use of plastic encapsulated microelectronic devices, or PEMs. Topics covered will include critical materials aspects of PEMs, the myriad types of physical and electrical defects, materials and process based problems, device screening, qualification, accelerated testing, reliability verification and much more.

Modern Wire Bonding Technologies- This highly practical and up-to-date seminar fully covers all of the parameters involved in this critical mainstay interconnect technology for today's high performance microelectronics. Subjects covered include all modern wire bonding technologies, wire bonding principles, package types, materials and metallurgy, bond testing, bond quality, failure mechanisms, wire bond design, tradeoffs, trends, and much more.

Soldering and Cleaning for High Performance Electronic Packaging- This comprehensive seminar, on what may perhaps be the most critical problem area in modern high density circuit board packaging assemblies, will clearly present both the basics and state-of-the-art technology. Subjects covered will include the basic critical properties of solders, advanced soldering technologies and problems, reliability of solder joints, no-lead and non-metallic materials and processes, advanced cleaning techniques including no-clean and use of low solids fluxes, and much more. This course will be highlighted by some revealing case histories.

Solder Joint Reliability in High Performance Electronic Packaging- This seminar, thoroughly covering one of the most common and most critical problems in electronic assemblies, is taught by one of the best industry experts. Topics covered include the nature, types, and sources of solder joint failure, the operational stresses which cause these failures, overcoming solder joint reliability problems, test plans for isolating problems and correlation of test results to real life, variations in considerations and action plans for the various types of advanced microelectronic interconnect systems, data analysis, modeling techniques, and case studies. This is truly a real world course.

Thermal Management for Electronic Systems- This seminar on one of the most critical areas of electronic packaging will address thermal management approaches for a wide range of electronic equipment. Advances in passive, active and hybrid thermal management schemes will be presented. Thermal design considerations for single chip packages, portable equipment, desktops/workstations and high end computing machines will be described. The importance of a combined computational modeling and experimentation type approach will be stressed. The increasing role of system level computational modeling will be discussed along with an in-depth examination of its advantages and limitations.

Mechanical and Thermomechanical Stress Behavior in Electronic Packaging- This outstanding new seminar presents a thorough analysis of this increasingly critical aspect of electronic packaging. The presentation explores key behaviors of electronics under stress producing conditions, including CTE mismatches, cyclic fatigue (high and low frequency), shock (mechanical and thermal), vibration (sinusoidal and random), temperature differentials (the T problem), and power cycling. Major packaging elements to be considered include solder, ceramic and plastic packages (with or without leads), leaded vs. leadless configurations, die attach, board construction, connections, encapsulants, and overcoats. Also included are mechanical and thermomechanical models and computer-based analysis.

Vibration and Shock Management for Electronic Systems- This thoroughly practical seminar covers another of those critical problems areas of functional electronic packages and assemblies. Subjects covered in this seminar include definitions, mathematics, undamped free vibration, damped free vibration, forced vibration with harmonic excitation, systems with two degrees of freedom, continuous systems, transient vibrations, numerical methods of analysis, random vibrations, and testing. Shock and vibration are both thoroughly covered.

Electrostatic Discharge Control in Electronics- This comprehensive seminar will be invaluable for all of those who must understand and apply electrostatic discharge and its control in the processing of electronic parts and assemblies. Subjects include basic forms and effects of ESD, theoretical and mathematical concepts, physical concepts, nature of static damage, damage models, latent ESD failures, analysis of failures, design elimination techniques, factory workplace guidelines, ESD control practices and management, industry standards, and case histories.

Failure Analysis and Nondestructive Testing for Electronics- This practical and comprehensive seminar will cover a wide range of electronics-related reliability problems & solutions with a focus on when and how to use the methodologies available to detect and diagnose the "root cause" of these problems. Technologies covered will encompass devices (microelectronics, discrete devices, etc.), materials, and assemblies. Methodologies will include electrical characterization, x-ray, and others, applicable to both the failure analysis laboratory and inspection controls on the production line.

Environmental Qualification and Stress Screening- This seminar is a fundamental presentation of the underlying physics and methodologies of qualification testing, burn-in, and environmental stress screening. Test results and their relationship to product reliability are discussed in terms of product costs, process control, and product supportability. Other subjects include applicability, management issues, test & screen development, etc.

Advanced Composite Materials for Electronic Packaging and Thermal Management- This seminar, taught by undoubtedly the leading industry expert in this area, comprehensively presents all of the important fundamentals, data, and guidelines for optimized application of these unique, advanced composite structure which offer significant performance improvements for modern electronic packages. Applications are both structural for lower thermal expansion stresses, and thermal, for major improvements in heat dissipation. Composites covered will include polymer matrix, metal matrix, ceramic matrix, and carbon/carbon composites.

Modern Adhesive Technologies- This practical, comprehensive and widely used seminar will fully cover all of the important materials, processes, tradeoffs and guidelines required to make the proper adhesive selection for the multitude of critical adhesive applications. Topics covered will include adhesion fundamentals, designing with adhesives, surface preparation, types and selection of adhesives, effects of environments, processing of adhesives, adhesive applications, testing, quality control, specifications, and much more. Completion of this course will result in an organized understanding of this widely misunderstood area of product design.

Failure Mode Effects Analysis- This timely and always important seminar fully covers assessment of techniques for testing and inspection to determine the inadequacy, and allows determination of priorities of failure modes. It also highlights potential failure modes that have not yet occurred and shows how to design out these modes to prevent future failures. All of the critical elements of FMEA design and FMEA process will be explained.

Internal Quality Auditor Training- This broadly important and high impact seminar, taught by a Baldridge Quality Award Examiner, is highlighted by a comprehensive series of class participation assignments and reviews, with role playing. Fully explained are elements of a world class quality system, types of audits, standards, pre-audit planning, checklist development, audit performance and execution, post-audit activities, audit follow-up, and much more.