AVAILABLE SEMINAR PROGRAMS
(Click on the seminar of interest.)

Modern Electronics Packaging
Ball Grid Array, Chip Scale, Flip Chip and Direct Chip Attachment Technologies
Ball Grid Array Technology
Advanced Hybrid and Multichip Module Packaging Technologies
Surface Mount Technology
Surface Mount Testing Technologies
Microvias and Other Advanced Printed Wiring Board Technologies
Electronic Packaging of High Speed Circuitry
Electronic Packaging of Microwave Systems
High Speed Digital Circuit Design
Mixed Analog/Digital Circuit Design
Integrated Circuits and Electronic Devices for Engineers and Managers
Modern Electronic Connectors and Technology
Materials for Electronics Packaging
Advanced Electronic Substrate Materials for RF and Microwave Circuitry
Plastics for Electronics
Conformal Coating Technologies
Reliability of Plastic Encapsulated Microelectronics
Modern Wire Bonding Technologies
Soldering and Cleaning for High Performance Electronic Packaging
Solder Joint Reliability in High Performance Electronic Packaging
Thermal Management for Electronic Systems
Mechanical and Thermomechanical Stress Behavior in Electronic Packaging
Vibration and Shock Management for Electronic Systems
Electrostatic Discharge Control in Electronics
Failure Analysis and Non-Destructive Testing for Electronics
Environmental Qualification and Stress Screening
Advanced Composite Materials for Electronic Packaging and Thermal Management
Modern Adhesives Technologies
Failure Mode Effects Analysis
Internal Quality Auditor Training