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Published by McGraw-Hill,
A Division of The McGraw Hill Companies
All books are available through amazon.com. |
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Electronic
Packaging and Interconnection Series
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| Title |
Author/Editor |
| Electronic
Packaging and Interconnection Handbook, 2nd Edition |
Harper |
| Electronic
Packaging, Microelectronics and Interconnection Dictionary |
Harper/Miller |
| Surface
Mount Technology for Concurrent Engineering and Manufacturing |
Classon |
| Electronic
Materials and Processes Handbook, 2nd Edition |
Harper/Sampson |
| Hybrid
Microelectronics Handbook, 2nd Edition |
Harper/Sergent |
| Modern
Solder Technology for Competitive Electronics Manufactoring |
Hwang |
| Ball
Grid Array Technology |
Lau |
| Flip
Chip Technologies |
Lau |
| Printed
Circuits Design |
Ginsberg |
| Multichip
Modules and Related Technologies |
Ginsberg/Schnorr |
| Multichip
Module Design, Fabrication and Testing |
Licari |
| Plastics
for Electronics: Materials, Properties, and Design Applications |
Alvino |
| Electronic
Packaging of High Speed Circuitry |
Konsowski/Helland |
| Printed
Circuit Board Materials Handbook |
Jawitz |
| Design
Guidelines for Surface Mount and Fine-Pitch Technology, 2nd Edition |
Solberg |
| Thin
Film Technology Handbook |
Elshabini-Riad |
| Electronic
Connector Handbook: Technology and Applications |
Mroczkowski |
| Active
Electronic Components Handbook |
Harper/Jones |
| Passive
Electronic Components Handbook |
Harper |
| Multichip
Module Technology Handbook |
Garrou/Turlik |
| Wire
Bonding in Microelectronics |
Harmon |
| Thermal
Management Handbook: For Electronic Assemblies |
Sergent/Krum |
| Electronics
Quality Management Handbook |
Ludwig-Becker |
| Flexible
Printed Circuitry |
Stearns |
| Reliability
of Electronic Packages and Semiconductor Devices |
DiGiacomo |
| Electronic
Failure Analysis Handbook |
Martin |
| Solder
Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies |
Lau and Pao |
| Design of Printed Wiring Board Assemblies |
Marks |
| An Introduction to Printed Circuit Boards |
Jawitz |
| Printed Wiring Boards for High Performance Systems |
Harper |
| Electronic
Packaging: Design, Materials, Process, and Reliability |
Lau et. al. |
| Chip
Scale Packaging |
Lau/Lee |
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Materials
Science and Engineering Series
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| Title |
Author/Editor |
| Handbook
of Plastics, Elastomers, and Composites, Third Edition |
Harper |
| Handbook of Ceramics, Glasses, and Diamonds |
Harper |
| Handbook of Adhesives and Sealants |
Petrie |
| Modern Plastics Handbook |
Harper |
